Peter C. Salmon dba Salmon Engineering

Systems engineer with new ideas about 3D packaging and heterogeneous integration. Dense electronic systems sit at the nexus of three innovations: 1) new substrate technology capable of 2 micron line and space or better in large panel formats 2) water cooling enabled by a water-impervious coating at the back sides of mounted chips 3)new methods of in-system testing and health monitoring, including redundancy, independently operable clusters of components, and agile reconfiguration managed by a system controller for adapting to changing workloads.